CDA EVG Series Instruções de Operação Página 162
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Bond Module
30 Copyright © 2013 EVG
4.3 Recipe Steps
This chapter lists all recipe steps available for the bond chamber.
Note: Available recipe steps depend on system configuration.
4.3.1
4.3.4
4.3.1.1
Set Temperature
4.3.4.1
Piston Down
4.3.1.2
Wait Temperature
4.3.4.2
Piston Up
4.3.1.3
Preheat
4.3.4.3
Wait Force
4.3.1.4
Equalize
4.3.5
4.3.2
4.3.5.1
Set Voltage
4.3.2.1
Evacuate
4.3.5.2
Wait Current
4.3.2.2
Purge
4.3.5.3
Wait Charge
4.3.2.3
Evacuate-Purge
4.3.5.4
Check Resistance
4.3.2.4
Wait Pressure
4.3.2.5
Purge Clean
4.3.3
4.3.3.1
Flags
4.3.3.2
Wafer Bow On
4.3.3.3
Timer
4.3.3.4
Monitoring
162 of 370
- 520HE Users Manual 1
- General Information 2
- 1 Note to the User 4
- 2 About this Manual 5
- 3 Recovery from Errors 6
- Interlock List 9
- Table of Contents 10
- 1 Interlock List 11
- 1.1 Leak Sensor 12
- 1.2 Water Flow Sensor 13
- 1.3 Over Temperature Sensor 14
- Location: 15
- 1.4 EMO Button 16
- 2 Circuit Diagrams 17
- Start Up and GUI 20
- 1 System Description 22
- 1.2 Safety 23
- 2 System Startup 24
- Figure 4 - Overview Stations 25
- De-embossing Station 28
- 30 of 370 30
- EVG Explorer 33
- 1 Overview 35
- 1.1 Title Bar 36
- 1.2 Main Area 36
- 1.2.1 Application Groups 37
- 1.2.1.1 Maintenance Tools 38
- 1.2.2 Applications 39
- 1.2.2.2 Maintenance Tools 40
- 1.2.3.1 Login / Change User 41
- 1.2.3.2 Log Off 41
- 1.2.3.3 Shut Down 41
- 1.3 Task Bar 42
- 1.3.2 Running Applications 43
- 1.3.3 Date and Time 43
- 2 “EVG Remote Support” Tool 44
- 2.1 EVG TechSupport offline 45
- 2.2 EVG TechSupport online 46
- 2.3 Benefits 47
- 2.4 Requirements 47
- 3 “EVG Manual Copy” Tool 48
- 3.2 Open Manual 49
- 3.3 Troubleshooting 49
- Start Up 54
- 1 Start Up 55
- 1.2 Initialize 57
- 1.3.1 Disconnected State 60
- 1.3.3 Ready State 61
- 1.3.4 Maintenance Mode 62
- Figure 12 - Maintenance Mode 62
- 1.3.5 Executing State 63
- 1.3.6 Cleanup State 63
- Figure 14 - Basic Layout 64
- Status Information 65
- Navigation Bar 66
- 2.1 Jobs 67
- 2.1.1 Overview Stations 68
- 2.1.1.1 Station Status 69
- Figure 21 - Slot States 70
- 2.1.2 Overview Jobs 71
- Figure 22 - Overview Jobs 71
- 2.2 Modules 72
- 2.3 Recipes 73
- 2.4 System 74
- 2.4.1 Overview 75
- Figure 27 - System Frame 76
- 2.4.2 Safety Doors 78
- 2.4.3 Tooling Profiles 79
- 2.4.4 Facility Management 80
- 2.4.5 Tracking 81
- 2.5 Setup 82
- Add User 83
- Remove User 83
- Properties 83
- 2.5.2 Light Tower Settings 84
- 3.1 Job Controls 85
- 3.2 Clean Up (optional) 86
- 3.3 Add Job 87
- Jobs 88
- Figure 38 - Add Job Window 88
- 3.4 Execute Job 90
- 4.1 Recipe Namespace 92
- 4.1.3 Delete Namespace 93
- 4.2 Recipe Overview 94
- 4.2.1 Select Namespace 95
- 4.2.2 Select Single Recipe 96
- Figure 47 - Recipe Selection 97
- Figure 48 - Common Task View 97
- 4.2.4 Select Version 98
- Figure 50 - Common Task View 98
- 4.3 Create New Recipe 99
- Figure 54 - Sample Recipe 100
- EVG CIMFramework - Core 101
- 4.3.3 Recipe Commands 101
- Figure 55 - Recipe Commands 101
- 4.3.4 Recipe Flow Diagram 101
- 4.3.5 Common Task View 102
- 4.4 Edit Recipe 104
- 4.4.3 Recipe Command Menu 105
- 2 bond modules: 106
- 4 cooling chucks: 106
- 10 buffer station slots: 106
- 4.4.3.4 Copy Recipe Command 107
- 4.4.4 Context Menu 108
- 4.4.5 Delete Recipe Command 109
- 4.4.6 Link Recipe Commands 109
- 4.5 Open Recipe 110
- 4.6 Save Recipe 111
- 4.7 Export Recipe 112
- 4.8 Delete Recipe 113
- 4.9 Recipe Validation 114
- 4.10 Recipe Linking 115
- 4.11 Recipe Code 116
- 5 Safety Doors 117
- 5.2 Open Safety Doors 118
- 5.3 Close Safety Doors 120
- 6 Analysis 121
- 6.2 DataValue State 122
- 6.3 Performance Tracking 123
- 124 of 370 124
- 6.4 Reports 125
- 7 Alarms 126
- 7.2 Alarm Situation 127
- 8.1 I/O Axis Field 128
- 9 Shut Down 129
- Shut Down 130
- History 131
- EV Group Support: 132
- Bond Module 133
- Module Description 135
- 1 Module Description 136
- 1.2 Bond Module 137
- 138 of 370 138
- 1.3 Bond Chuck 139
- 1.4 Safety 140
- Figure 7 - Cover Clamp 141
- 1.4.3 Facility Problems 142
- 2 Process Description 143
- 2.2 Anodic Wafer Bonding 145
- 2.3 Adhesive Wafer Bonding 146
- 2.4 Glass Frit Wafer Bonding 147
- 2.5 Eutectic Wafer Bonding 148
- Process Description 149
- 150 of 370 150
- 3.1 Jobs 152
- 3.2 Modules 153
- 154 of 370 154
- GUI 155
- Figure 17 - Vacuum System 155
- Designation 156
- 4 Recipe Programming 157
- 4.2 Recipes 158
- Recipe Programming 159
- Sequence Recipe Editor 159
- 4.2.1.1 Move Recipe Step 161
- 4.3 Recipe Steps 162
- 4.3.1 Heater 163
- 4.3.1.2 Wait Temperature 164
- 4.3.1.3 Preheat 165
- 4.3.1.4 Equalize 166
- 4.3.2 Vacuum System 167
- 4.3.2.2 Purge 168
- 4.3.2.3 Evacuate-Purge 169
- 4.3.2.4 Wait Pressure 170
- 4.3.3 General 172
- 4.3.3.3 Timer 173
- 4.3.3.4 Monitoring 174
- 4.3.4 Piston 175
- 4.3.4.3 Wait Force 176
- 4.3.5 Voltage 177
- 4.3.5.2 Wait Current 178
- 4.3.5.3 Wait Charge 179
- 4.3.5.4 Check Resistance 180
- 5 High Level Menu 181
- 5.1 Cover 183
- 5.2 Heater 184
- 5.3 Piston 185
- 5.4 Vacuum System 186
- Figure 42 187
- High Level Menu 187
- 5.4.3 Evacuate – Purge 187
- Figure 41 187
- 5.5 High Voltage 188
- 5.6 Flags 189
- 5.7 Recorder 189
- 5.8 Wafer Bow 190
- 5.9 Resistance 191
- 6 Recorder Software 192
- 6.2 Choose Parameters 193
- Recorder Software 195
- 6.3 Measure Bars 196
- 6.3.2 Move Measure Bar 197
- 6.3.3 Delete Measure Bar 197
- 6.4 Zoom 198
- 6.5.1 Grids 199
- 6.5.2 File Info 199
- 6.5.3 “Printing” 200
- 6.5.4 “About Recorder” 200
- 6.5.5 Save / Open 200
- Maximum Piston Force 203
- 1 Maximum Piston Force 205
- 208 of 370 208
- Note to the User 210
- 4 Copyright © 2012 EVG 211
- 1 Note to the User 212
- 2 Safety 213
- 3 Daily Maintenance 214
- 3.2 Main Pressure 215
- Daily Maintenance 216
- 3.3.1 Allowed Gases 217
- 218 of 370 218
- 3.4 Bond Tools 219
- 3.4.1 Bond Tool Insert 220
- Figure 7 221
- 3.5 Flags 222
- 3.6 Clamping Feet 223
- 3.7 Clamping Force 224
- 3.7.2 Prepare Bondchuck 225
- 3.7.6 Measurement 227
- 3.7.7 Clamping Force 228
- Figure 18 - Grub screw 229
- Figure 19 229
- Figure 20 - Clamping arm 229
- Figure 21 - Top view 230
- Figure 22 - Front view 231
- Figure 18- Force Gauge 231
- Measurement: 232
- 3.8 Clamping glasses 233
- 4 Weekly Maintenance 234
- 28 Copyright © 2012 EVG 235
- Weekly Maintenance 236
- Parameters 237
- Max. Pressure cannot be kept 238
- Figure 24 - Hydraulic System 239
- Figure 25 240
- Figure 26 240
- Figure 27 241
- Figure 28 242
- Figure 29 243
- 4.3.2.1 Schematics 244
- With backpressure control 245
- Function description 246
- 40 Copyright © 2012 EVG 247
- Components 249
- Figure 35 - Top Cap 250
- Figure 37 - Square Plate 251
- Figure 38 - Piston Rod 251
- Removing of obsolete parts 253
- Figure 41 - Leak Line 254
- Figure 42 - Separation Tank 254
- 48 Copyright © 2012 EVG 255
- Settings 256
- 50 Copyright © 2012 EVG 257
- Figure 46 - Apply Caliper 258
- 52 Copyright © 2012 EVG 259
- Figure 48 - Apply Caliper 260
- Tech tips 261
- Figure 50 - Load Cell 262
- 4.4 High Voltage 263
- 4.5 Cover Clamps 264
- 58 Copyright © 2012 EVG 265
- 4.5.1 Working principle 266
- 4.6 Wafer Bow 267
- 62 Copyright © 2012 EVG 269
- 64 Copyright © 2012 EVG 271
- 4.6.1.3 CAN System 272
- 1 Coarse zero 273
- (edge – zero) 273
- 2 Fine zero 273
- 4.7 Uniformity Check 274
- Figure 59 - SI Wafer 275
- 4.7.2 Check Flatness 277
- 4.7.3 Heater Flatness 278
- Figure 64 - Bottom Heater 279
- 4.7.4 Bond Tool Flatness 280
- 74 Copyright © 2012 EVG 281
- 4.8 Flag Pulling Mechanism 282
- 4.8.1 Adjustment of Flags 283
- 4.8.1.2 Flag Orientation 284
- 4.9 Pressure Insert 285
- 286 of 370 286
- Figure 78 287
- Figure 79 - Clamp 288
- Figure 80 - Fix disc 288
- Figure 81 289
- Figure 82 289
- 4.10 Cleaning 290
- 4.11.1 Pfeifer – THM07x 291
- Figure 84 - Water System 293
- Figure 85 - Water System 294
- 4.13.1 Reset procedure 295
- 5 Monthly Maintenance 296
- 5.3 Tool Detection 297
- 5.4 Piston Motion 298
- 5.5 Load Cell Test 298
- Figure 93 299
- Figure 95 300
- 94 Copyright © 2012 EVG 301
- Figure 99 - Remove screw 302
- Figure 100 303
- Figure 101 303
- Monthly Maintenance 304
- Figure 104 305
- Mainswitch 307
- 5.7.3 Check EMO Button 308
- 5.8 Vacuum System 309
- 5.8.1 Maintenance Evacuate 310
- 5.8.2 Maintenance Purge 310
- 311 of 370 311
- 5.9 Safety Valve 312
- 5.10 Gauges 313
- 5.11 Roughing Pump 314
- 5.12 Cover Open/Close 314
- 5.13 Check of Sensors 315
- Figure 118 - Leakage Sensors 316
- 5.14 Water filter 317
- 5.16 Water Flow 317
- 5.16.1 Adjust Water Flow 318
- 5.16.2 Chiller 318
- 5.17 Cooling Chucks 319
- 1 Cooling Bottom ON 320
- 2 Cooling Bottom 320
- 321 of 370 321
- Figure 123 323
- 5.17.3 Cooling Time 324
- 325 of 370 325
- 327 of 370 327
- 329 of 370 329
- 330 of 370 330
- 5.19.1 Top Side 331
- 5.19.2 Bottom side 332
- 6 Quarterly Maintenance 333
- 6.2.2 Thermo Chuck 334
- 6.2.3 Maintenance Frequency 335
- 6.3 Adjust heater offset 336
- 337 of 370 337
- 6.4 TC Wafer Test 338
- 7 Annual Inspection 339
- 7.2 Cooling Lines 340
- Figure 134 - Water System 341
- Annual Inspection 342
- 343 of 370 343
- 8 Troubleshooting 344
- 345 of 370 345
- 8.3 Endvacuum not reached 346
- 8.4 No High Voltage 347
- 348 of 370 348
- 10 Lockout/Tagout 349
- 11 Facility Requirements 350
- 11.1 EVG520 351
- EaseUS Todo Backup 354
- 1 General Information 356
- 1.3 Pre-OS 357
- 2 Create Backup 358
- Figure 2 - System Backup 359
- Figure 4 - Backup progress 360
- 2.3 Create a Bootable Media 361
- Figure 7 - Building progress 362
- 3 How to Recover 363
- 3.1 Recover from Backup File 364
- How to Recover 366
- 3.3 Recover using Pre-OS 367
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