CDA EVG Series Instruções de Operação Página 202
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Bond Module
70 Copyright © 2013 EVG
EV Group Support:
Phone:
Fax:
E-Mail:
North America
+1 480 305 2400
+1 480 305 2401
TechSupportUS@EVGroup.com
Phone:
Fax:
E-Mail:
Japan
+81 45 348 1237
+81 45 348 0666
service@EVGroup.jp
Phone:
Fax:
Korea
+82 (2) 3218 4400
+82 (2) 3218 4401
Phone:
Fax:
E-Mail:
All other locations
+43 7712 5311 3000
+43 7712 5311 3500
TechSupportSD@EVGroup.com
State:
Released
Author:
WAA
File:
EVG_Framework-BondModule_EO_eng_2.3_rev_02.doc
Created on:
2011-08-08
Printed on:
2013-10-24
Version:
2.0
Last revision
2011-11-18
Purpose:
Operation
Language:
EN
202 of 370
- 520HE Users Manual 1
- General Information 2
- 1 Note to the User 4
- 2 About this Manual 5
- 3 Recovery from Errors 6
- Interlock List 9
- Table of Contents 10
- 1 Interlock List 11
- 1.1 Leak Sensor 12
- 1.2 Water Flow Sensor 13
- 1.3 Over Temperature Sensor 14
- Location: 15
- 1.4 EMO Button 16
- 2 Circuit Diagrams 17
- Start Up and GUI 20
- 1 System Description 22
- 1.2 Safety 23
- 2 System Startup 24
- Figure 4 - Overview Stations 25
- De-embossing Station 28
- 30 of 370 30
- EVG Explorer 33
- 1 Overview 35
- 1.1 Title Bar 36
- 1.2 Main Area 36
- 1.2.1 Application Groups 37
- 1.2.1.1 Maintenance Tools 38
- 1.2.2 Applications 39
- 1.2.2.2 Maintenance Tools 40
- 1.2.3.1 Login / Change User 41
- 1.2.3.2 Log Off 41
- 1.2.3.3 Shut Down 41
- 1.3 Task Bar 42
- 1.3.2 Running Applications 43
- 1.3.3 Date and Time 43
- 2 “EVG Remote Support” Tool 44
- 2.1 EVG TechSupport offline 45
- 2.2 EVG TechSupport online 46
- 2.3 Benefits 47
- 2.4 Requirements 47
- 3 “EVG Manual Copy” Tool 48
- 3.2 Open Manual 49
- 3.3 Troubleshooting 49
- Start Up 54
- 1 Start Up 55
- 1.2 Initialize 57
- 1.3.1 Disconnected State 60
- 1.3.3 Ready State 61
- 1.3.4 Maintenance Mode 62
- Figure 12 - Maintenance Mode 62
- 1.3.5 Executing State 63
- 1.3.6 Cleanup State 63
- Figure 14 - Basic Layout 64
- Status Information 65
- Navigation Bar 66
- 2.1 Jobs 67
- 2.1.1 Overview Stations 68
- 2.1.1.1 Station Status 69
- Figure 21 - Slot States 70
- 2.1.2 Overview Jobs 71
- Figure 22 - Overview Jobs 71
- 2.2 Modules 72
- 2.3 Recipes 73
- 2.4 System 74
- 2.4.1 Overview 75
- Figure 27 - System Frame 76
- 2.4.2 Safety Doors 78
- 2.4.3 Tooling Profiles 79
- 2.4.4 Facility Management 80
- 2.4.5 Tracking 81
- 2.5 Setup 82
- Add User 83
- Remove User 83
- Properties 83
- 2.5.2 Light Tower Settings 84
- 3.1 Job Controls 85
- 3.2 Clean Up (optional) 86
- 3.3 Add Job 87
- Jobs 88
- Figure 38 - Add Job Window 88
- 3.4 Execute Job 90
- 4.1 Recipe Namespace 92
- 4.1.3 Delete Namespace 93
- 4.2 Recipe Overview 94
- 4.2.1 Select Namespace 95
- 4.2.2 Select Single Recipe 96
- Figure 47 - Recipe Selection 97
- Figure 48 - Common Task View 97
- 4.2.4 Select Version 98
- Figure 50 - Common Task View 98
- 4.3 Create New Recipe 99
- Figure 54 - Sample Recipe 100
- EVG CIMFramework - Core 101
- 4.3.3 Recipe Commands 101
- Figure 55 - Recipe Commands 101
- 4.3.4 Recipe Flow Diagram 101
- 4.3.5 Common Task View 102
- 4.4 Edit Recipe 104
- 4.4.3 Recipe Command Menu 105
- 2 bond modules: 106
- 4 cooling chucks: 106
- 10 buffer station slots: 106
- 4.4.3.4 Copy Recipe Command 107
- 4.4.4 Context Menu 108
- 4.4.5 Delete Recipe Command 109
- 4.4.6 Link Recipe Commands 109
- 4.5 Open Recipe 110
- 4.6 Save Recipe 111
- 4.7 Export Recipe 112
- 4.8 Delete Recipe 113
- 4.9 Recipe Validation 114
- 4.10 Recipe Linking 115
- 4.11 Recipe Code 116
- 5 Safety Doors 117
- 5.2 Open Safety Doors 118
- 5.3 Close Safety Doors 120
- 6 Analysis 121
- 6.2 DataValue State 122
- 6.3 Performance Tracking 123
- 124 of 370 124
- 6.4 Reports 125
- 7 Alarms 126
- 7.2 Alarm Situation 127
- 8.1 I/O Axis Field 128
- 9 Shut Down 129
- Shut Down 130
- History 131
- EV Group Support: 132
- Bond Module 133
- Module Description 135
- 1 Module Description 136
- 1.2 Bond Module 137
- 138 of 370 138
- 1.3 Bond Chuck 139
- 1.4 Safety 140
- Figure 7 - Cover Clamp 141
- 1.4.3 Facility Problems 142
- 2 Process Description 143
- 2.2 Anodic Wafer Bonding 145
- 2.3 Adhesive Wafer Bonding 146
- 2.4 Glass Frit Wafer Bonding 147
- 2.5 Eutectic Wafer Bonding 148
- Process Description 149
- 150 of 370 150
- 3.1 Jobs 152
- 3.2 Modules 153
- 154 of 370 154
- GUI 155
- Figure 17 - Vacuum System 155
- Designation 156
- 4 Recipe Programming 157
- 4.2 Recipes 158
- Recipe Programming 159
- Sequence Recipe Editor 159
- 4.2.1.1 Move Recipe Step 161
- 4.3 Recipe Steps 162
- 4.3.1 Heater 163
- 4.3.1.2 Wait Temperature 164
- 4.3.1.3 Preheat 165
- 4.3.1.4 Equalize 166
- 4.3.2 Vacuum System 167
- 4.3.2.2 Purge 168
- 4.3.2.3 Evacuate-Purge 169
- 4.3.2.4 Wait Pressure 170
- 4.3.3 General 172
- 4.3.3.3 Timer 173
- 4.3.3.4 Monitoring 174
- 4.3.4 Piston 175
- 4.3.4.3 Wait Force 176
- 4.3.5 Voltage 177
- 4.3.5.2 Wait Current 178
- 4.3.5.3 Wait Charge 179
- 4.3.5.4 Check Resistance 180
- 5 High Level Menu 181
- 5.1 Cover 183
- 5.2 Heater 184
- 5.3 Piston 185
- 5.4 Vacuum System 186
- Figure 42 187
- High Level Menu 187
- 5.4.3 Evacuate – Purge 187
- Figure 41 187
- 5.5 High Voltage 188
- 5.6 Flags 189
- 5.7 Recorder 189
- 5.8 Wafer Bow 190
- 5.9 Resistance 191
- 6 Recorder Software 192
- 6.2 Choose Parameters 193
- Recorder Software 195
- 6.3 Measure Bars 196
- 6.3.2 Move Measure Bar 197
- 6.3.3 Delete Measure Bar 197
- 6.4 Zoom 198
- 6.5.1 Grids 199
- 6.5.2 File Info 199
- 6.5.3 “Printing” 200
- 6.5.4 “About Recorder” 200
- 6.5.5 Save / Open 200
- Maximum Piston Force 203
- 1 Maximum Piston Force 205
- 208 of 370 208
- Note to the User 210
- 4 Copyright © 2012 EVG 211
- 1 Note to the User 212
- 2 Safety 213
- 3 Daily Maintenance 214
- 3.2 Main Pressure 215
- Daily Maintenance 216
- 3.3.1 Allowed Gases 217
- 218 of 370 218
- 3.4 Bond Tools 219
- 3.4.1 Bond Tool Insert 220
- Figure 7 221
- 3.5 Flags 222
- 3.6 Clamping Feet 223
- 3.7 Clamping Force 224
- 3.7.2 Prepare Bondchuck 225
- 3.7.6 Measurement 227
- 3.7.7 Clamping Force 228
- Figure 18 - Grub screw 229
- Figure 19 229
- Figure 20 - Clamping arm 229
- Figure 21 - Top view 230
- Figure 22 - Front view 231
- Figure 18- Force Gauge 231
- Measurement: 232
- 3.8 Clamping glasses 233
- 4 Weekly Maintenance 234
- 28 Copyright © 2012 EVG 235
- Weekly Maintenance 236
- Parameters 237
- Max. Pressure cannot be kept 238
- Figure 24 - Hydraulic System 239
- Figure 25 240
- Figure 26 240
- Figure 27 241
- Figure 28 242
- Figure 29 243
- 4.3.2.1 Schematics 244
- With backpressure control 245
- Function description 246
- 40 Copyright © 2012 EVG 247
- Components 249
- Figure 35 - Top Cap 250
- Figure 37 - Square Plate 251
- Figure 38 - Piston Rod 251
- Removing of obsolete parts 253
- Figure 41 - Leak Line 254
- Figure 42 - Separation Tank 254
- 48 Copyright © 2012 EVG 255
- Settings 256
- 50 Copyright © 2012 EVG 257
- Figure 46 - Apply Caliper 258
- 52 Copyright © 2012 EVG 259
- Figure 48 - Apply Caliper 260
- Tech tips 261
- Figure 50 - Load Cell 262
- 4.4 High Voltage 263
- 4.5 Cover Clamps 264
- 58 Copyright © 2012 EVG 265
- 4.5.1 Working principle 266
- 4.6 Wafer Bow 267
- 62 Copyright © 2012 EVG 269
- 64 Copyright © 2012 EVG 271
- 4.6.1.3 CAN System 272
- 1 Coarse zero 273
- (edge – zero) 273
- 2 Fine zero 273
- 4.7 Uniformity Check 274
- Figure 59 - SI Wafer 275
- 4.7.2 Check Flatness 277
- 4.7.3 Heater Flatness 278
- Figure 64 - Bottom Heater 279
- 4.7.4 Bond Tool Flatness 280
- 74 Copyright © 2012 EVG 281
- 4.8 Flag Pulling Mechanism 282
- 4.8.1 Adjustment of Flags 283
- 4.8.1.2 Flag Orientation 284
- 4.9 Pressure Insert 285
- 286 of 370 286
- Figure 78 287
- Figure 79 - Clamp 288
- Figure 80 - Fix disc 288
- Figure 81 289
- Figure 82 289
- 4.10 Cleaning 290
- 4.11.1 Pfeifer – THM07x 291
- Figure 84 - Water System 293
- Figure 85 - Water System 294
- 4.13.1 Reset procedure 295
- 5 Monthly Maintenance 296
- 5.3 Tool Detection 297
- 5.4 Piston Motion 298
- 5.5 Load Cell Test 298
- Figure 93 299
- Figure 95 300
- 94 Copyright © 2012 EVG 301
- Figure 99 - Remove screw 302
- Figure 100 303
- Figure 101 303
- Monthly Maintenance 304
- Figure 104 305
- Mainswitch 307
- 5.7.3 Check EMO Button 308
- 5.8 Vacuum System 309
- 5.8.1 Maintenance Evacuate 310
- 5.8.2 Maintenance Purge 310
- 311 of 370 311
- 5.9 Safety Valve 312
- 5.10 Gauges 313
- 5.11 Roughing Pump 314
- 5.12 Cover Open/Close 314
- 5.13 Check of Sensors 315
- Figure 118 - Leakage Sensors 316
- 5.14 Water filter 317
- 5.16 Water Flow 317
- 5.16.1 Adjust Water Flow 318
- 5.16.2 Chiller 318
- 5.17 Cooling Chucks 319
- 1 Cooling Bottom ON 320
- 2 Cooling Bottom 320
- 321 of 370 321
- Figure 123 323
- 5.17.3 Cooling Time 324
- 325 of 370 325
- 327 of 370 327
- 329 of 370 329
- 330 of 370 330
- 5.19.1 Top Side 331
- 5.19.2 Bottom side 332
- 6 Quarterly Maintenance 333
- 6.2.2 Thermo Chuck 334
- 6.2.3 Maintenance Frequency 335
- 6.3 Adjust heater offset 336
- 337 of 370 337
- 6.4 TC Wafer Test 338
- 7 Annual Inspection 339
- 7.2 Cooling Lines 340
- Figure 134 - Water System 341
- Annual Inspection 342
- 343 of 370 343
- 8 Troubleshooting 344
- 345 of 370 345
- 8.3 Endvacuum not reached 346
- 8.4 No High Voltage 347
- 348 of 370 348
- 10 Lockout/Tagout 349
- 11 Facility Requirements 350
- 11.1 EVG520 351
- EaseUS Todo Backup 354
- 1 General Information 356
- 1.3 Pre-OS 357
- 2 Create Backup 358
- Figure 2 - System Backup 359
- Figure 4 - Backup progress 360
- 2.3 Create a Bootable Media 361
- Figure 7 - Building progress 362
- 3 How to Recover 363
- 3.1 Recover from Backup File 364
- How to Recover 366
- 3.3 Recover using Pre-OS 367
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